84864010
Machines and apparatus, as follows: machine-tools for working material by removal of material, by the processes specified in 8456 (including laser or other light or photon beam, ionic-beam or electron beam processes); optical and other microscopes;drawing or marking-out instruments;die attach apparatus, tape automated bonders, and wire bonders for the assembly of semiconductors;encapsulation equipment for the assembly of semiconductors;for bending, folding and straightening semiconductor leads; soldering, brazing or welding machines, of a kind described in 8515, for working metal, incorporating a computer control;industrial robots, being automated machines for transport, handling and storage of semiconductor wafers, wafer cassettes or wafer boxes;ij.   injection or compression moulds for rubber or plastics for the manufacture of semiconductor devices
Aynı HS-6 diğer ülkelerde
Bu bilgiler yalnızca rehberlik amaçlıdır. Tarife kodları ve tedbirler yürürlük tarihi, ürün özellikleri, menşe ve ilgili gümrük idaresinin değerlendirmesine göre değişebilir. Nihai beyan öncesi resmi kaynak veya uzman ile doğrulayın.