84862010
Machines and apparatus, as follows: appliances (including spraying appliances) for wet-etching, developing, stripping or cleaning semiconductor wafers;physical deposition apparatus (including apparatus for deposition by sputtering) on semiconductor wafers;chemical vapour deposition apparatus;machine-tools for working material by removal of material, by the processes specified in 8456 (including laser or other light or photon beam, ionic-beam or electron beam processes);epitaxial deposition machines; industrial or laboratory electric furnaces or ovens;spinners for coating photographic emulsions on semiconductor wafers;for dry-etching patterns on semiconductor materials;ij. ion implanters for doping semiconductor materials;apparatus for the projection or drawing of circuit patterns on sensitised semiconductor materials;sawing machines for sawing wafers into chips;dicing machines for scribing or scoring semiconductor wafers
Aynı HS-6 diğer ülkelerde
Bu bilgiler yalnızca rehberlik amaçlıdır. Tarife kodları ve tedbirler yürürlük tarihi, ürün özellikleri, menşe ve ilgili gümrük idaresinin değerlendirmesine göre değişebilir. Nihai beyan öncesi resmi kaynak veya uzman ile doğrulayın.