84862010

Machines and apparatus, as follows: appliances (including spraying appliances) for wet-etching, developing, stripping or cleaning semiconductor wafers;physical deposition apparatus (including apparatus for deposition by sputtering) on semiconductor wafers;chemical vapour deposition apparatus;machine-tools for working material by removal of material, by the processes specified in 8456 (including laser or other light or photon beam, ionic-beam or electron beam processes);epitaxial deposition machines; industrial or laboratory electric furnaces or ovens;spinners for coating photographic emulsions on semiconductor wafers;for dry-etching patterns on semiconductor materials;ij. ion implanters for doping semiconductor materials;apparatus for the projection or drawing of circuit patterns on sensitised semiconductor materials;sawing machines for sawing wafers into chips;dicing machines for scribing or scoring semiconductor wafers

Machines and apparatus, as follows: appliances (including spraying appliances) for wet-etching, developing, stripping or cleaning semiconductor wafers;physical deposition apparatus (including apparatus for deposition by sputtering) on semiconductor wafers;chemical vapour deposition apparatus;machine-tools for working material by removal of material, by the processes specified in 8456 (including laser or other light or photon beam, ionic-beam or electron beam processes);epitaxial deposition machines; industrial or laboratory electric furnaces or ovens;spinners for coating photographic emulsions on semiconductor wafers;for dry-etching patterns on semiconductor materials;ij. ion implanters for doping semiconductor materials;apparatus for the projection or drawing of circuit patterns on sensitised semiconductor materials;sawing machines for sawing wafers into chips;dicing machines for scribing or scoring semiconductor wafers

Same HS-6 in other countries