84861010
Machines and apparatus, as follows: for growing or pulling monocrystal semiconductor boules;machine-tools for working material by removal of material, by the processes specified in 8456 (including laser or other light or photon beam, ionic-beam or electron beam processes);spin dryers for semiconductor wafer processing; sawing machines for sawing monocrystal semiconductor boules into slices;grinding, polishing or lapping machines;industrial or laboratory electric furnaces or ovens
Machines and apparatus, as follows: for growing or pulling monocrystal semiconductor boules;machine-tools for working material by removal of material, by the processes specified in 8456 (including laser or other light or photon beam, ionic-beam or electron beam processes);spin dryers for semiconductor wafer processing; sawing machines for sawing monocrystal semiconductor boules into slices;grinding, polishing or lapping machines;industrial or laboratory electric furnaces or ovens
Same HS-6 in other countries
This information is provided for guidance only. Tariff codes and measures may change by effective date, product characteristics, origin and the assessment of the relevant customs authority. Verify with the official source or a qualified expert before final clearance.